Products
Wire Bonders build the core of our product family, where Modularity and Uniformity of components are most important to us.
Beginning with Manual Bonders for lab use and prototyping over to Semiautomatic Machines for pilot manufacturing we offer a continuous chain of equipment leading to Fully Automatic Machines suitable for Fully Integrated and Automated Production Lines. This significant product diversity provider us with a very unique ability.
Wire Bonders
- F&K Delvotec is the only manufacturer supplying machines covering the complete spectrum of wire bonding technologies: gold ball bonding, gold ball bumping, wedge bonding for fine gold, aluminium wire and ribbon, wedge bonding for power devices with heavy aluminium wire.
Fully Integrated Assembly Lines
- Our integrated lines for die and wire bonders ensure you profit from the strong points of our specialized systems. Further benefits result from our experience in dispensing, die placement, wire bonding and encapsulating. F&K Delvotec automation provides the advantage of an integrated process and quality control over multiple assembly stages.
